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Solder Wire

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Key Features

  • Application High Soldering Temperature
  • Standards RoHS Compliant
  • Container Type Spool
  • Solder Series SCN M1
  • Features Higher Strength Due to Nickel Compared to Other Silver-Free Alloys, Reduced Fe Leaching to Increase Tip Life Time and Reduce Tip Consumption by upto 70%, Reduced Splash of Flux and No-Clean Flux, Solder Joint Shines (Perfect Optics), Very Fast Wetting Even on Difficult Surfaces, as Dirty and Oxidized Materials
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Product Information

Dimensions

Wire Diameter 1 mm
Diameter 1 mm
Dimensions 1 mm x 100 g

Details

Item Solder Wire
Application High Soldering Temperature
Standards RoHS Compliant
Container Type Spool
Solder Series SCN M1
Features Higher Strength Due to Nickel Compared to Other Silver-Free Alloys, Reduced Fe Leaching to Increase Tip Life Time and Reduce Tip Consumption by upto 70%, Reduced Splash of Flux and No-Clean Flux, Solder Joint Shines (Perfect Optics), Very Fast Wetting Even on Difficult Surfaces, as Dirty and Oxidized Materials
Composition 99.3% Tin, 0.6% Copper, 0.05% Nickel
Flux Requirement Contains Flux Core
Flux Classification ROM1
Solder Composition Tin-Copper-Nickel
Minimum Soldering Temperature 442 Degrees F
Material Composition 99.3% Tin, 0.6% Copper, 0.05% Nickel
Melting Temperature (Maximum) 444 Degrees F
Maximum Soldering Temperature 444 Degrees F
For Joining Metal
Melting Temperature (Minimum) 442 Degrees F
Soldering Temperature Range 442 Degrees F to 444 Degrees F
Form Flux-Cored Wire
Weight 100 g
Flux Type No-Clean

Description

Solder Wire, Form Flux-Cored Wire, Material Composition 99.3 Percent Tin, 0.6 Percent Copper, 0.05 Percent Nickel, Wire Diameter 1 mm, Weight 100 g, Melting Temperature (Minimum) 442 Degrees F, Melting Temperature (Maximum) 444 Degrees F, Flux Type No-Clean, Flux Classification ROM1, Solder Series SCN M1, For Joining Metal, Application High Soldering Temperature, Container Type Spool

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