Potting Compound

We have the potting compound you need to get the job done right.

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(Showing 1 - 15)

Mfr # 2136

Key Features:

  • Item: Splicing Resin
  • Volume: 1.5 oz
  • Container Type: Closed Mixing Pouch
Mfr # 270

Key Features:

  • Item: Instant Adhesive
  • Type: Potting Compound for Electronic Components
  • Application: Potting, Sealing, And Bonding Electronic Components
Mfr # 2216

Key Features:

  • Item: Urethane Adhesive
  • Color: Black
  • Container Type: Dual-Cartridge
Mfr # 270

Key Features:

  • Item: Epoxy Adhesive
  • Type: Noncorrosive
  • Application: Bonding, Potting
Mfr # 2216

Key Features:

  • Item: Instant Adhesive
  • Type: Epoxy, Room Temp. Cure, High Shear and Peel
  • Application: Produces Flexible Bonds And May Be Applied With Spatula Or Trowel
Mfr # 7100104991

Key Features:

  • Item: Mixing Nozzle
  • Application: For Dispensing and Mixing Two-Component Epoxy
  • Mixing Ratio: 1:1, 2:1
Mfr # DP270

Key Features:

  • Package Quantity: 1
Mfr # 80611166069

Key Features:

  • Item: Splicing Resin
  • Volume: 292 mL
  • Container Type: Guard Bag
Mfr # 85-12

Key Features:

  • Item: Resin Compound Splice Kit
  • Wire Range: 1 to 2/0 AWG
  • Container Type: Closed Mixing Pouch
Mfr # 2216

Key Features:

  • Item: Epoxy Adhesive
  • Type: Kit
  • Application: May be applied with spatula, trowel, or flow equipment.
Mfr # EZ 72GP

Key Features:

  • Item: Edgebander
  • Voltage: 220 V
  • Amps: 20 A
Mfr # 72-N4

Key Features:

  • Item: Resin Compound Splice Kit
  • Wire Range: 22 to 10 AWG
  • Container Type: Closed Mixing Pouch
Mfr # 2216

Key Features:

  • Item: Epoxy Adhesive
  • Type: Part B
  • Application: May be applied with spatula, trowel, or flow equipment.
Mfr # 2216

Key Features:

  • Item: Hot Melt Adhesive
  • Type: Kit
  • Application: May be applied with spatula, trowel, or flow equipment.
Mfr # 404

Key Features:

  • Item: Fiberglass Resin
  • Container Type: Can
  • Size: 1 gal