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322-HCS5P2-100=HOLTITE CNT

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Key Features

  • Sleeve Plating Material Tin
  • Socket Type Discrete
  • Contact Mating Area Plating Material Gold
  • Hole Size (Recommended) 1.04 mm [ .041 in ]
  • Mating Pin Diameter Range (in) .011 to .018, .016 to .021
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Product Information

Dimensions

Hole Size (Recommended) 1.04 mm [ .041 in ]
Mating Pin Diameter Range (in) .011 to .018, .016 to .021
Socket Length 2.54 mm [ .1 in ]
Mating Pin Diameter Range (mm) .28 to .46, .406 to .533

Details

Sleeve Plating Material Tin
Socket Type Discrete
Contact Mating Area Plating Material Gold
Profile Zero
Sleeve Material Copper
Contact Current Rating (A) 5
Spring Material Beryllium Copper
Contact Type Socket
PCB Thickness (Recommended) .79 to 3.18 mm [ .03 to .05 in ]
Insertion Method Hand/Semi-Automatic/Automatic
Contact Transmits (Typical) Signal (Data)/Power
Contact Spring Plating Material Tin
Product Type Contact
Wire/Cable Type Discrete Wire
Applies To Printed Circuit Board
Contact Base Material Beryllium Copper

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